Popis
Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 80 °C，8h |
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 260 - 280 °C |
| Bed Temperature (with Glue) | 90 - 110 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.20 g/cm³ |
| Vicat Softening Temperature | 119 °C |
| Heat Deflection Temperature | 117 °C |
| Melting Temperature | 228 °C |
| Melt Index | 32.2 ± 2.9 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 55 ± 4 MPa |
| Breaking Elongation Rate | 3.8 ± 0.3 % |
| Bending Modulus | 2310 ± 70 MPa |
| Bending Strength | 108 ± 4 MPa |
| Impact Strength | 34.8 ± 2.1 kJ/m² |
Bambu Lab Filament - PC 1kg
1129 Kč